The Newsletter Volume 28, Number 3 is avaialble now. The contents of the Newsletter are as follows:
- Message from the 28th President of the AKPA
- KPS, together with AKPA
- Featured Article 1: Dirty Superfluid
- Featured Article 2: Ultrafast Terahertz Radiation Generation
- Flash News: The First 7 TeV Proton-Proton Collisions at LHC
- AKPA Annual Meeting held at Portland, Oregon
- Upcoming events and meetings
Thanks to the E-link and Web Management Committee, AKPA homepage now has a new look since Aug. 31, 2010.
The Newsletter Volume 28, Number 4 is avaialble now. The contents of the Newsletter are as follows:
- Message from the 28th President of AKPA
- Featured Article 1: New Frontiers in Atomically-Engineered Complex Oxides
- Featured Article 2: Rationale and benefit of a new force at TeV scale
- Report on the Physics Symposium of the UKC 2010
- Audit Report
- Solicitation of Nominees for AKPA OYRA 2011
- Election for the 30th AKPA President and Auditor
- Upcoming Events and Meetings
You are cordially invited to propose a chapter proposal for the Book on "Green IT: Technologies and Applications" to be published by Springer-Verlag and sponsored by KSEA. Topics include Green Communications, Green Computing, Regulations and Standards, and Innovative Applications. Please, see this for the details.
- Proposal Submission: November 15, 2010
- Full Chapter Submission: February 28, 2011
- Publication: June 20, 2011
The American Institute of Physics (AIP) seeks nominations for the $10,000 Prize for Industrial Applications of Physics. The AIP Prize is awarded for successful applications of physics to proven, innovative technologies. The contribution may be a product, a process, or a tool enabling practical application. Actual benefit to the employer is a significant criterion.
The nomination deadline is April 1, 2011. Nominations should include:
1. A cover letter providing a description of the work for which the nomination is being made, its commercial significance, and a draft citation.
2. Nominee's curriculum vita listing relevant publications and patents.
3. Letters of support (no more than four).
For the full details, please see this.
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